The latest leak from insider Digital Chat Station suggests that, according to industry forecasts, memory price increases could level off by 2027. The latest LPDDR6 memory specifications will also see a significant price increase next year, and this may only be reflected in new pro-level phones equipped with MediaTek Dimensity 9600/Qualcomm Snapdragon 8 Elite Gen 6 processors. Industry experts believe that LPDDR6 memory is expected to ship next year.
IT Home, citing WCCFTech, reported that SK Hynix plans to increase its DRAM production capacity more than eightfold by 2026. The core of this expansion is SK Hynix’s production base in Incheon, South Korea, where monthly production of 1C DRAM wafers is expected to increase significantly from the current 20,000 wafers to 140,000 wafers.
For comparison, a single memory module could be used to directly disrupt the mobile phone and computer industries, as everyone is cutting back on their products, and next year, 2026, there could be major product changes. The strategy of flooding the market with too many models is over.”
It is being seen that most of the new memory being manufactured is being allocated for machines that perform heavy AI tasks, such as AI servers and high-end computing systems. These will primarily use two types of memory: GDDR7, which is very fast graphics memory, and SOCAMM, which provides higher performance with less power.
